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Samsung’s Next-Gen HBM4 Memory To Enter Mass Production By End-2025, Tape-Out To Be Achieved Next Quarter – Wccftech


Samsung looks to take the lead in the next-gen HBM4 memory markets, as the Korean giant is set to tape out the cutting-edge tech by the end of this year.

Samsung’s HBM4 Memory Is Expected To Come Head-To-Head With SK hynix’s Counterpart; Competition Will Be Fiercer This Time

The HBM industry is growing rapidly under the AI hype, with demand skyrocketing to new levels. This has prompted firms like Samsung and SK hynix to evolve their HBM products to cater to the fuel of innovation that is currently at its peak in the markets. Interestingly, we never really had an update on Samsung’s HBM4 memory, apart from the fact that the Korean giant is in the process of development, but a new report from The Elec has disclosed details surrounding Samsung’s next HBM product, claiming that it’s ready for mass-production by the end of 2025.

It is reported that Samsung has initiated preliminary work around the HBM4, with the Korean giant expected to reach the tape-out stages by Q4 2024. Tape-out usually means that a particular product has its designs and production methodologies finalized, so in light of this, we can conclude that Samsung’s HBM4 memory is slated to debut in the markets by next year. Samsung’s HBM4 is expected to reach product sampling stages soon as well, and while we are unaware of the company’s potential customers, NVIDIA and AMD are going to be in the line.

Talking about Samsung’s HBM4 specifications, it is said that the firm will employ both logic and semiconductor dies, which is a new route discovered by the industry for progression in HBM capabilities. It is disclosed that the Korean giant will employ its own 4nm process from the foundry division and will utilize the 10nm 6th-generation 1c DRAM, which is known as one of the highest end in the markets. Interestingly, it is rumored that SK hynix has decided to employ the 1c DRAM as well, in light of Samsung’s strategy, so the competition is fierce.

HBM4 is going to play a massive role in the future of computing markets, given that it is expected to witness integration into mainstream next-gen AI products, such as the Rubin architecture from NVIDIA, along with AMD’s MI400 lineup. The big question here is which of the two firms, Samsung or SK hynix, will receive the attention from the markets, and that’s something only time will decide.

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